Rather than a single specification, VPX is a set of base, environmental, mechanical and dot specifications, defining several – mainly rugged – capabilities and features for new VITA-compliant systems. 6U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. 0 specification for use in Mil/Aero VPX systems. CompactPCI Serial Chassis. or 1. Any kind of project specific variations can be provided on request. 3VIO, Short tail connectors on J1, long tail connectors on J2. We offer air & conduction cooled power supply units for wide range AC as well as DC input. Chassis: 1 ATR, 6U 11-slot, VME/VPX-based conduction-cooled solution. Optionally the customer can have conduction cooling arrangement for single slots or for the complete chassis. Maximum power dissipation depends on cold plate. or 1. Tested to MIL-STD-810, VITA47. 97"H Chassis Cooling: Conduction-Cooled, Natural Convection-Cooled. Trident’s rugged small form factor (SFF) commercially off the shelf (COTS) embedded computer is designed for harsh environments of military, aerospace and heavy industries and addresses the challenging need for many space constrained applications in avionics, aerospace and defense industries. 5-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. Because VITA 48. Compared to conventional wedgelocks, the ICE-Lok ® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. Sizes from 1/2 ATR to 3/4 ATR are available with various backplane architectures. or 1. Dawn’s 3U form factor conduction cooled chassis for cold plate deployment is designed for all rugged environments; Airborne, Land and Sea. 8 does not use module-to-chassis conduction cooling, it also promises to help drive innovative use of new lightweight polymer or composite material-based chassis. Conduction cooled VME electronics Vibration: Card-edgetempen_re: Number of VME modules 20 0. scroll down . MPMC-961x Modular Computer 1-slot; MPMC-962x Modular Computer 2-slot; MPMC-965x Modular Computer 5-slot;. CompactPCI Serial Chassis Platforms. Aitech Defense. The liquid-cooled chassis sidewalls will support electronic modules each dissipating in excess of 150 watts. (L) x 4. 2. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system. 64PS1 - North Atlantic Industries. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. Table top rubber feet. New High-Density 3U VPX Switches and Chassis Support Dual 100Gb Ethernet, 8x Gen4 PCIe, or 16 LVDS. 0 specification. 3V, 5V, +12V_Aux, -12V_Aux & 3. Operating at wire-speed, these networking modules can be used to architect a. Offered as part of firm’s Test/Development chassis for OpenVPX, CompactPCI and VME/VME64x systems, products fit in IEEE 1101. Chassis is capable to provide withstand Shock and Vibration defined by MIL-STD-810 as followed: - Shock: 40G in both Positive and. 8” pitch versus a typical 1. Conduction cooling moves the heat from the printed board through a heat transfer surface to the chassis walls and structure where the air circulating nearby removes the heat. They are designed for circuit boards. Important Notice: Other accessories, manuals, cables, calibration data, software, etc. System in accordance with IEC 60297‐3‐101, ‐102, ‐103; IEEE 1101. The C162 is based on Intel’s Calpella (Arrandale + ECC) platform comprising an i7 dual-core/four thread (Intel Hyper-Threading® Technology) processor with large integrated on-chip L1, L2 and shared L3 caches as well as a companion QM57 PCH I/O. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. The XPand6200 Series is a true Commercial-Off-The-Shelf (COTS) rugged system, supporting many 3U VPX, XMC, and PMC modules without modifications to the chassis or backplane to accommodate I/O. The XPand1202 provides a low-cost, flexible, VITA 67 development platform. Ability to work with existing board, frame, or chassis designs. 66A ON. VPX is specified for 3U and 6U boards and for air cooled, conduction cooled and even liquid cooled chassis. ATR Chassis For Conduction-Cooled VME Boards Product Information Radstone ATR chassis provide the highest level of environmental protection combined with exceptional packing density and thermal performance. VITA 62 power connector. ATR, rugged, air- and conduction-cooled, Integrated Systems} kontron {VME Rugged-Standard-3 to 18 slot} MacroLink Inc. 700 W VITA62 PSU | conduction cooled | 6 U | 5 HP | DC. The chassis comes with different sizes and are equipped with various backplane options vis-à-vis 3U/6U. Status LED indicators allow users to verify proper Operating Temperature: -4 to 122 F; Type: Rack. EMI/RFI Power Line Filtering. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. VPX-4U-Chassis-Datasheet. 0 CompactPCI standard, which uses the parallel PCI bus for communication among a. Such means com prises a modified convection-cooled VME compatible chas sis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. heat to the chassis walls and finally to a cold plate. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. Conduction Cooled VMEbus Modules. Switches, bridges and clock modules (PXIe), and even cooling are modular allowing for easy customization. It supports up to two 0. Type 11 19" Embedded Card Cages from ELMA Electronic Inc. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. VME and VME64x VPX Power Backplanes Universalbus Test Adapters Components Power Supplies 19" Power. 2-16 VPX slots at 1” pitch. Input Voltages: 85-264 VAC, 5. PXI /. Revolutionary design allows for up to 175 watts per slot of conduction cooling. 0” slot pitch), and can also accommodate mezzanine cards as needed. For all rugged environments: Air, Land, and Sea. 3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules. Level 1-5 Air, Conduction Cooled : Optimized for lower power consumption : DSP221: PCI Express, VXS 6U, XMC/PMC : QorIQ T2081 @ 1. 0 specification for use in. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. The VPX340 (400W) and VPX336 (360W) can be used to power VPX / Open VPX chassis and will fit into the standard envelope defined by VITA 48. VME and VME64x VPX Power Backplanes Universalbus Test Adapters Components Power Supplies 19" Power. Dawn. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Airborne, shipborne and ground deployment. 8” slot. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. The Ruggedized Enhanced Design Implementation (VPX. 15A in 1A steps, +12V_AUX 0. 3U / VITA 62 / 400W. 0 specification for use in Mil/Aero VPX systems. 0 in. Our selection of Intel, NXP Power. The newest VITA specification is VPX. Verifies chassis can meet power requirement and specifications for VPX. Optionally it can be outfitted with a rear transition card cages. 2 coaxial/RF for four of the slots (defaultbackplane routing) All I/O are thru the front of the chassis; 250W integrated. Utilizing our extensive experience in embedded. 2. 1-1997 while providing a low profile, practical packaging solution for high-performance. 0 Serial: 2 RS-232/422/485, 4 RS-232 FPGA: Xilinx Artix-7. Product Type: Chassis. 100G Ethernet Data plane. High Quality Chassis and Enclosures for High Speed CompactPCI Serial Applications (up to PCIe Gen. Ordering Information: Dawn P/N 11-1017332-01. Product Information ATR Chassis For Conduction-Cooled VME Boards Available in multiple ARINC 404A sizes: 1ATRLong, 1ATRShort, 3/4ATRShort, 1/2ATRShort Choice of cooling options: – Fan assisted with integral fan – Using air ducted through a rear plenum – Conduction through base or sidewall – Liquid Pluggable 28 VDC, 115 VAC and 270VDC. Our modular, aluminum chassis variants give you many different and interchangeable options for VPX and cPCI, as well as our rugged small form factor VITA 73. ATR Chassis. The chassis houses a five-slot 6U VME64X backplane accommodating up to five top-loaded conduction cooled 6U VME boards, including power supply, and a 300W 28VDC plug in power supply that is MIL-STD-740D and MIL-STD-461C compliant. The planar heat pipes are also called vapor chambers which are used as. Conduction cooling methods move heat from the source to a cooler area over a short distance; the heat can then be removed by liquid- or forced-air cooling. The P0CC1 6U PMC Carrier is a single slot replacement unit supporting two single or one double width PMC which can beDocumentation. Feature packed. Conduction-cooled VME cards use wedge locks instead of the normal injector/ejector, and they do not have a front panel like traditional convection-cooled VME cards. 3 Slot to 5 Slot each. This switching power supply accepts a +5 VDC input and converts it to a single +3. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. Supports complete range of convection- and conduction-cooled formats (IEEE 1101. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. This platform supports up to eight 0. Elma offers both standard and custom subracks for a wide variety of bus standards including VME, VME64x and VXI systems. Orion's team of experienced engineers is available to work with you to provide a solution designed around your specific requirements. High-Performance Cooling with 8 fans in Push/Pull. 1, 1101. pdf;Physical Characteristics. All conductive plates and surfaces are typically aluminum. GS16 is a fully rugged, fully managed, standalone Gigabit Ethernet switch providing 16 10/100/…. FREMONT, Calif. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. VME and VME64x VPX Power Backplanes Universalbus Test Adapters Components Power Supplies 19" Power. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. Revolutionary design allows for up to 175 watts per slot of conduction cooling. 2) modules. Ordering Information: Dawn P/N 11-1017632-01. The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. Heat frames can be designed for compliance with IEEE 1101. From our extensive line of COTS chassis to the most intricate custom solution, Hartmann is the most trusted resource for all rack-mount and desktop chassis needs. The chassis interface 400 comprises convection bridge heat exchanger 402, standard 6U VME electronics module 404, a heat flow 406, an air flow 408, a card slot pitch height 410, generic 6U VME backplane 420, generic 6U VME connectors 412, a modified chassis side panel 414, a wedgelock clamp 416, and non-conduction-cooled standard. With moveable rear profiles (up to 2. • Backplane Slots: 9 VME64x J1/J2 Slots. 3 and/or AMC. 0 inch pitch. Environment: Extended Temperature, Extended shock & vibration : Height: 10. PXI /. 0 in. The XPedite8171 is an Intel® Atom™ E3800-based 3U VPX-REDI single board computer available in conduction- and air-cooled configurations. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. It consists of a tunable laser(s), i wavelength tagging Michelson intefferometer, an optical distnl_Jti_“The solution there is primarily conduction cooling, dissipating 100 to 150 watts per enclosure, with a ceiling of more than 40 watts per slot in a 6U form factor. Type 12R2, 9U, 19" Rackmount, MIL-Rugged, Vertical Chassis. Example: 44KS2 +5 VDC to +3. Extended Description. True 6-Channel design provides full OpenVPX. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. VME-6U-COOL has 12 positions for fans to be mounted. 5mm) to 1. 3/4 ATR, conduction-convection cooled. Conduction-cooled builds are for use in. Next news articleDawn’s VPX Development System for 6U OpenVPX boards aligns well with the requirements specified within Draft 1. {Tower-Desktop-Industrial-Rugged-[Military] to 901D} Extreme Engineering Solutions {VPX and CompactPCI Development Platforms, Deployed Systems, ATR, rugged, air- and conduction-cooled, Integrated Systems} Designed by Dawn’s engineers to specifically support OpenVPX and VPX REDI 3U boards and modules. 5-slot, 6U OpenVPX (VITA 65) backplane, 1-in pitch. 600-Watt DC/DC Converter, 6U VME. 5A, 3. 3V. Choice of Power Supply. These enclosures support 3U and 6U backplanes and are. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. The high-density components that enable high-speed I/O also use more power, making advanced cooling methods essential for rugged VPX designs. It is conduction-cooled through the card edge/wedgelock. The system is designed with enhanced EMC features. The recessed card cage fits 5-slots of VPX at 1-inch pitch with side-to-side push-pull cooling. X-ES also has an extensive lineup of XMC and PMC solutions to fulfill your data-processing and I/O. HiK™ card frames increase thermal conductivity. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. Permissible Current Load: 5V_VS3 0A. These rugged enclo-sures are available to support either one-inch or 0. CompactPCI Serial Chassis. A means to utilize conduction-cooled VME electronics mod ules in an air cooled system is provided. ATR Chassis For Conduction-Cooled VME Boards Product Information Radstone ATR chassis provide the highest level of environmental protection combined with exceptional packing density and thermal performance. 0 specification for use in Mil/Aero VPX systems. The rugged chassis holds 6U conduction-cooled boards with a 1-inch pitch per VITA 48. 3U CompactPCI. Hartmann is able to deliver a more rugged 19” solution when compared to the standard, as necessary or desired. VXS uses a straightforwardFPGA-Based VME Bridge; IPMI for VPX Systems; Cisco IOS-XE® Embedded Services Routing; Built-In Test (BIT) coreboot & FSP for Intel; Green Hills INTEGRITY. The VME195-x mini crate is the perfect choice for small setups with only a few VME64x modules. January 25, 2021. The XPand1303 is a low-cost, flexible, development platform. The 9U, 12R2 is designed to meet the harsh environment of shipboard, airborne, and ground mobile applications per MIL-STD ’s. This design and development were by MSS, including all the Windows-based software and qualification to full DO-160. 62” deep without handle) Customized Front Input/Output (I/O) Panel; Connector layout per customer requirement (option per MIL-DTL-M38999) Meets MIL-STD-810F for. Airborne, shipborne and ground deployment. Now available from electronics packaging specialist Schroff is a range of conduction-cooling assemblies (CCAs) that have been designed specifically for use in VPX, VME and CompactPCI systems. PXI /. VME and VME64x Systems. AC and DC power input variants available. The chassis can accept a front and a Rear Transition Module (RTM). Power and reset LEDs are provided for. The Hybricon portable tower conduction-cooled enclosures are high performance development chassis with cooling for up to 150W per slot. PXI Express Chassis. 4-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. The backplane provides seven slots, each cooled up to 100 W; one slot for storage, one for switch and five payload slots. International Journal of Science and Research (IJSR) ISSN: 2319-7064 SJIF (2022): 7. CompactPCI Serial Chassis. Packaged as a single-slot VME module, the conduction-cooled ruggedized C5100-R conforms to the IEEE 1101. 8" &' 1. Dawn’s embedded RuSH technology provides intelligence for precision monitoring and control. 0 specification. PXI /. Dawn VME Products is committed to leadership in SOSA modules and infrastructure. The chassis comes with different sizes and. View product. Additionally, full military-grade conduction cooled requirements can also be accommodated with Elma’s. The power supply is thermally attached to the bulkheads for heat removal. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. Up to 800 Watts power output with 1 inch pitch form factor. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. The system is designed with enhanced EMC features. WILDSTAR 3XV7 3U OpenVPX FPGA Processor – WB3XV7. 20 dimensions for conduction cooling, and meets the VITA 47 ECC4 ruggedization specifications for shock, vibration, and operating temperature range of -40° C to +85° C. These PSUs are available in 3U or 6U form factor. Boards are inserted in the back of the chassis in a vertical orientation. PICMG 2. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Kontron's standard selection of 3U and 6U CompactPCI card cages and ready integrated system platforms. GS16. Configuration: • No Modules Installed. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. The Open Frame Chassis have built in manual controlled 120mm front fans and monitoring for fan and voltages. 3U / VITA 62 / 800W. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. Intel®. Find the right VME or VME64x system for your application, available with horizontal or vertical card cages, as subrack or desktop versions, pluggable or open frame power supplies and included cooling concept: VMEbus and VME64x systems available for 6U boards. 87"W x 3. Reverse side wedge locks. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. Communications Intelligence (Ground Mobile) SIP designs communication and signals intelligence computers for rugged ground mobile applications. VME / VME64x Chassis. It is conduction-cooled through the card edge/wedgelock. Up to 128 Gbytes DDR4 memory for server grade applications. Universal AC Input. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. CompactPCI Serial Chassis. Even though conduction cooling typically is the least expensive thermal-management approach for rugged systems, it still introduces some costs in the form of metal card edges that conduct heat. Min. Backplanes options - cPCI, PCI, VME64x, VME/VME64, VPX and custom. Backplane is Fabric Mapping Module overlay-ready and configurable to meet any data plane connection fabric. Power Supplies are available in 3U and 6U, in air- and conduction- cooled form factors >for cPCI, VPX, VME64x & custom applications. Any kind of project specific variations can be provided on request. 66A steps, 3V3_VS2 0A. The crate offers 9 VME64x slots in a compact designed chassis with integrated low noise power supply and cooling fan. The Isothermal Card Edge (ICE)-Lok® is designed to enhance thermal performance for conduction-cooled embedded computing systems. 8” slot. -199 in order to ensure interoperability and common good practices. For example, developments can begin on the bench with 6-slot air-cooled systems and then migrate to 12-slot 19" rack equipment or conduction-cooled ATR solutions while using the same plug-in card. XCalibur1931 NXP QorIQ T2080 Processor-Based Conduction- or Air-Cooled 6U VME SBC with Eight Gigabit Ethernet Ports The XCalibur1931 single board computer provides up to 8 GB of DDR3. 0 specification for use in Mil/Aero VPX systems. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. CompactPCI Serial Chassis. 6U VPX air cooled as per VITA 62, front Panel with Extractor handle, 160 mm deep. 2, AMC. The tubular heat pipes typically have outer diameters from 1/16″ (1. 66A ON/OFF, -12V_AUX 0. VITA 46. (COTS), air or conduction cooled single stage converters according to the ANSI/VITA 62. VITA 62 power connector. Files (3) VPX VITA CARD 3U /. VME VME P2 Figure 3: PPCM1 I/O Diagram Ruggedization Levels PPCM1 is available in Radstone’s 5 environmental ruggedization levels (see Table 1). The Air Transportation Rack (ATR) is the de-facto standard form factor for aircraft board electronic equipment since more than 50 years. Thermal barrier coatings (TBCs) are a multilayer coating of a combination of low thermal conductivity, high melting-point ceramics and alloy materials. Terminal, 8 slots: On-board Schottky barrier diodes. 3U Conduction cooled models available in 1″ form factor. CompactPCI Serial Chassis. Get more information on our VME Processors, such as the 6U VME7555 and VME7653 from Orion Technologies on. Designed for rugged conduction cooled assemblies (CCAs) in VPX systems,. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor. The card comes standard with LED configuration, a front panel reset switch, and two single-wide PMC slots. Systems Integration Plus, Inc. Watch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. PICMG 2. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. Heat frames can be designed for compliance with many industry standards. 600-Watt DC/DC Converter, 6U VME. Utilizing our extensive experience in embedded. 10. VME backplane. Designed for mission critical applications. (H) Four 0. 3 VDC output at 75 Watts. Related To: Dawn. Compared to conventional wedge locks, the ICE-Lok creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. Test chassis can test up to 6 Conduction Cooled VME 6U cards. The P0CC1 6U PMC Carrier is a single slot replacement unit supporting two single or one double width PMC which can beForm Factor: 6U VPX Chassis Type: Development Number of Slots: 2 Dimensions: 17. The XPand1203 is a low-cost, flexible, development platform. 16. VTX989 is a five slot 3U VPX conduction cool chassis; Base plate cooling (cold wall is in the bottom of the chassis) Integrated Power Module within the Chassis; Support for VITA67. Subrack based, sheet metal, desktop or tower configurations. 8 slot conduction cooled 3U VPX chassis; 6 SSD removable drive bay; Minimal Cables / Edge Card; Multiple configurations, interfaces, and integrations. Related products. Architecture: VPX/OpenVPX : Cooling: Liquid-Cooled : Depth: 12. Conduction cooled ATR Chassis; Development Chassis; IEEE 1101. Why We Are the Leaders in COTS FPGA-Based High Performance Computing. 6-Slots of 3U VPX with integral 6-channel intelligent 400W power supply. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. Depending on your processing requirements, XPand3200 Series systems can be populated with high-performance, low-power 3U VPX or 3U cPCI modules designed and manufactured by X-ES. Power and reset LEDs are provided for system status. PXI Express Chassis. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. With 6U-VME conduction cooling, power dissipation per slot is limited by the cold plate on which the chassis is mounted. Provision for mounting GPS/1PPS/10MHZ source in the chassis. PXI Express Chassis. Operating Temperature > 8 slots: 0°C. VME64x 2U/84HP 4 Slots. 5 Hz 20fe_ 0. Chassis GND: Continuous chassis GND surface where backplane is mounted to rack, comes with M3 screw for chassis GND. Paper ID: SR22628105125 DOI: 10. 3U Conduction Cooled OpenVPX / SOSA Development Chassis. VTX989 is a five slot 3U VPX conduction cool chassis; Base plate cooling (cold wall is in the bottom of the chassis) Integrated Power Module within the Chassis; Support for VITA67. Input Voltages: 19-35 VDC. pitch air-cooled VPX (VITA 48. 0. RiCool design provides 2000W of power cooling 125W/slot (more if chassis height is increased). Front mounted power switch. Conduction Cooled Version of Pixus VPX Chassis Manager. X-ES provides a line of high-performance, rapid-development 3U VPX Rugged COTS-Based Systems. ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length) Dimensions: 10. The Dawn PSC-6236 can be special ordered to support high current single channel applications. SOSA™ Aligned Technology CapabilitiesThis rugged 3U VPX air conduction-cooled chassis from Elma is for avionics, land vehicles, and other military SWaP-constrained applications. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. 11 modular extrusions. Thermal design, simulation and analysis services. 3) CompactPCI Serial is an industrial standard for modular computer systems. The card slots within a chassis hold the heat frames that PCB boards attach to. VME64x 2U/84HP 4 Slots. Conduction cooled base coupled, via short and efficient path, provides for optimum cooling. About. View Orion's Single Board Computers here. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. This large scale, naval system had a complete HiK™ back-plane and utilize natural convection cooling. Offered as part of firm’s Test/Development chassis for OpenVPX, CompactPCI and VME/VME64x systems, products fit in IEEE 1101. RME-6430 7U 19” Rack Mount Enclosure for 3U VPX. Find 6U VME Chassis related suppliers, manufacturers, products and specifications on GlobalSpec - a trusted source of 6U VME Chassis information. PSC-6236 Product DatasheetLiquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. CAD templates and 3D printed prototypes available. Revolutionary design allows for up to 175 Watts per slot of conduction cooling; Precision machined from 6061 T6 Aluminum; Corrosion. Operating temperature range is -40°C to +85°C. 11") Connectors: 2 mm press-fit, quality grade 2. The XPand1201 is a low-cost, flexible, development platform. Extended Description. 2. Related To: Dawn VME Products6U VME64x 195-x Mini Chassis. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. It is conduction-cooled through the card edge/wedgelock. The stronger the need for computer power, the more. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. We take pride in being able to fulfill the majority of our customers’ needs through custom development. For a chassis with sealed side walls and lid. This specification is applicable to, but not limited to, the VMEbus standard, an internal interconnect (backplane) bus intended for connecting processing elements to their immediate fundamental resources. Elma's new liquid cooled chassis is available with a 6U OpenVPX backplane on a 1" pitch per VITA 65 Backplane Profile BKP6. VME and VME64x Systems. 64PS1 - North Atlantic Industries. Edge board with MIL-DTL-38999 circular connectors. VITA Stabilized Maintenance Description. The standard model is conduction to wedge lock.